Horizontal Grinding Machines for Advanced Material Wafers

Horizontal Grinding Machines for Advanced Material Wafers

SKU:
EHG Series
Brand:
Warranty:
N/A
Price: Contact
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Hotline: +84 906 988 447  

Head Office: Ho Chi Minh City

  • Tel: +84 2839 778 269 / 3601 6797
  • Email: sales@lidinco.com
  • Add: 487 Cong Hoa Street, Ward 15, Tan Binh Dist, HCM City, Vietnam

Office: Bac Ninh City

  • Tel: +84 222 730 0180
  • Email: bn@lidinco.com
  • Add: 184 Binh Than Street, Vo Cuong Ward, Bac Ninh City, Vietnam
  • Counseling Technical Counseling 100% Free
  • Shipping Free Shipping For 3.000.000vnd Order
Specification

Data is being updated

Description

The Engis EHG Horizontal Grinding machines are the perfect companion when back-thinning or preparing wafers such as sapphire, silicon carbide and gallium nitride. These unique systems are designed to economically surface grind, as well as back-side grind, LED wafers to the highest level of flatness and surface finish, saving time and labor costs.

Key Features


• PLC Based 12” Touch Screen Control Panel

• Independent Control of Grinding Wheel and Work
Piece Rotation
• Fixed or Oscillating Grinding Wheel Function
• Automatic Tool Wear Compensation
• Automatic Measuring and Thickness Control
• Data Management Capable

Additional Benefits


• User friendly set-up
• Easy wheel changing
• Rapid stock removal
• Increased throughput
• Compatible with 24” lapping machine

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