High-Precision Automatic Lapping System EJW-610IFN-2AL/CMP

Name: High-Precision Automatic Lapping System EJW-610IFN-2AL/CMP
Brand: Engis
SKU: EJW-610IFN-2AL/CMP
Price: 0VND VND
Availability: InStock
Rating: 0.00 (0 reviews)

SKU:

EJW-610IFN-2AL/CMP

0 ratings

Brand:

Engis

Warranty:

N/A

Price: Contact

Please contact to check stock

Request a quote

There are currently no promotions for this product

Hotline: +84 906 988 447

Head Office: Ho Chi Minh City

Tel: +84 2839 778 269 / 3601 6797
Email: sales@lidinco.com
Add: 487 Cong Hoa Street, Ward 15, Tan Binh Dist, HCM City, Vietnam

Office: Bac Ninh City

Tel: +84 222 730 0180
Email: bn@lidinco.com
Add: 184 Binh Than Street, Vo Cuong Ward, Bac Ninh City, Vietnam

Technical Counseling 100% Free
Free Shipping For 3.000.000vnd Order

Specification

Data is being updated

Description product
Accessories

Description

EJW-610IFN-2AL/CMP is a high-precision automatic lapping system that is optimum for sapphire wafers or SiC wafers use in manufacturing LEDs and power devices that require high-precision lapping and polishing processes. This system is equipped with a high-precision facing unit and uses a lapping plate of maximum 610 mm (24”) in outer diameter. It allows simultaneous lapping of two wafers put into vacuum contact with the vacuum chuck by pressurizing, driving, and oscillating them.

Features

• Processing of up to 8” wafers
• Clean and safe wafer handling with vacuum chucks
• Use of a 2-axis motorized drive mechanism that allows high throughput as well as stable lapping and polishing

• Automatic-sizing mechanism, mountable as an option
• LCD touch-panel screen for easy operation

• High-precision facing unit
• Up to 10 recipes can be registered by the multi-step program

Specifications

System Model	EJW-610IFN-2AL/CMP
Lapping Plate Diameter	Outer diameter ø610 mm (24″) x Inner diameter ø100 mm (Special specifications)
Number of Pressure Heads	Two heads
Dimensions	W2,000 mm x D2,000 mm x H2,000 mm
Weight	1,300 kg