M-Bond 610 Adhesive
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Specification
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Description
M-Bond 610 is excellent for adhering multiple samples for TEM dimpling and bonding of post-polished samples to grids for TEM and FIB observation. It is chemically resistant and provides a very thin glue line that ion mills evenly.
71-20000 | M-Bond 610, 2-Part Adhesive, 25 g Systems (Pk/4) |
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